Resume · ZW / Systems

Selected Engineering Projects

Designed and assembled three generations of a mixed-signal audio platform, progressing from a six-layer Teensy 4.1 board with four codecs to a simplified CS42526 platform and a standalone architecture using a bare i.MX RT1062, CS42526, and ESP32.
Completed end-to-end Rev 2 bring-up and functional validation: verified codec communication and configuration, synchronized 48 kHz digital-audio clocking, produced buffered analog sine-wave output, and drove an external amplifier and speaker through RCA.
Diagnosed and corrected a firmware data-path corruption fault, then used bring-up findings to improve clocking, analog interfaces, grounding and layout, debug access, power sequencing, subsystem isolation, USB/UI integration, and testability. Rev 3 was assembled; power-up and functional validation are pending.

Developed a six-layer integrated audio platform using dual TPA3255 Class-D power stages, an ADAU1467 DSP, PCM3168A codec, ESP32-S3 control, and four BTL output channels targeting approximately 150 W per channel.
Analyzed the 48 V power network, PDN and inrush behavior, bulk-capacitance tradeoffs, high-current copper geometry, return-current paths, and mixed-signal/Class-D layout constraints; revised the power, protection, and PCB architecture based on the results.
Designed around staged first-power bring-up, subsystem isolation, test access, assembly constraints, and manufacturability before fabrication. Hardware fabrication and functional validation have not yet been completed.

Developed a scan-to-CAD workflow for custom A-pillars, speaker adapters, and tweeter mounts using sectional 3D scanning, manual scan alignment, mesh reconstruction, Fusion 360, and iterative FDM-printed fitment.
Took a 6.5-inch door-speaker adapter through 10-20 design revisions to resolve window-track clearance, fastener tolerances, threaded inserts, material selection, printability, and finishing; produced and sold approximately 10 finished units at about $30 each.

Hardware Design: Mixed-signal and high-current PCB design · Multilayer PCB layout · Power distribution and PDN planning · Clocking · Grounding and return-current paths · Design for bring-up, debug, test access, and manufacturability
Embedded Hardware & Digital Interfaces: Teensy 4.1 · ESP32 / ESP32-S3 · i.MX RT1062 board integration · I²C · I²S · TDM · Digital-audio codec configuration
Engineering Tools: KiCad · Fusion 360 · LTspice / SPICE simulation · Blender · Digilent WaveForms
Lab & Fabrication: Oscilloscope · Digital multimeter · Logic analyzer · Digilent Analog Discovery · Bench power supply · Board bring-up and mixed-signal debugging · Hand and SMD soldering · Hot-air and PCB rework · FDM 3D printing · 3D scanning

Electrical Engineering Transfer Pathway

Starting Fall 2026

High School Diploma

Kennewick, WA · Dec 2024 - Aug 2025

Led small on-site teams, assigned work, trained new employees, prepared job-specific equipment and materials, and performed final quality inspections.
Managed customer walkthroughs, progress updates, final vehicle handoffs, payment collection, and before-and-after documentation.

Washington · Jan 2024 - Jul 2025

Supervised children during daily programs and field trips, maintained safety and accountability, developed activities, redirected routine behavior, and communicated end-of-day updates to parents.